Dadri, Gautam Buddha Nagar, Uttar Pradesh
Business Type | Manufacturer, Exporter, Supplier |
Brand Name | NST |
Material | Mild Steel |
Finishing | Polished |
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Preferred Buyer From
Location | Anywhere in India |
Product Details
NST-DUAL-HEAD HIGH VACUUM MAGNETRON PLASMA SPUTTERING COATER is designed for coating both single or multiple film layers for a wide range of materials, such as alloy, ferroelectric, semiconductor, ceramic, dielectric, optical, PTFE, etc.Compared with similar equipment, it has the advantages of small size and easy operation, and a wide range of materials that can be used. It is an ideal equipment for preparing various types of material films in the laboratory.
Technical Specifications
Input Power | Single phase 220 VAC 50 / 60 Hz, 2000 W (including vacuum pump and water chiller) |
Source Power | Two sputtering power sources are integrated into one control box DC source: 500 W power for coating metallic materials RF source: 300 W power, 13.56 MHz frequency for coating non-conductive materials |
Magnetron Sputtering Head | Two 2″ Magnetron Sputtering Heads with water cooling jackets and shutters are included One Sputting Head Model also available in this product page (in product options) One is connected to DC source for coating metallic materials The other one is connected to RF source for non-conductive materials Target size requirement: 2″ diameter Thickness range: 0.1 – 5 mm for both metallic and non-conductive targets (including backing plate) One Stainless Steel Target target and one Research Grade Al2O3 target are included for demo testing Customized coater: Two DC heads without RF; two RF heads without DC; 3 RF heads are available upon request |
Vacuum Chamber | Vacuum chamber: 300 mm Dia. ×300 mm Height, made of stainless steel Viewport: Two pieces of 100 mm Dia. glass. One fixed; one detachable for cleaning and replacement Hinged type lid with pneumatic power pole allows easy target change |
Sample Stage | Sample holder is a rotatable and heatable stage made of ceramic heater with copper cover Sample holder size: 140 mm Dia. for. 4″ wafer max Rotation speed: 1-20 rpm adjustable for uniform coating The holder temperature is adjustable from RT to 500 °C max (2 hr max) with accuracy +/- 1.0 °C via a digital temperature controller |
Gas Flow Control | Two precision mass flow controllers (MFC) are installed to allow inlet of two types of gasses Flow rate: 0–200 mL/min adjustable on the touch screen control panel Air inlet valve is installed for vacuum release |
Vacuum Pump Station | A mobile pump station is included. The sputtering coater can be placed on top of station High-speed turbo pump at speed 80L/S is combined with a two-stage mechanical pump (220 L/min) for max vacuum level and faster pumping speed Standard vacuum level connected with chamber : < 4.0E-5 Torr. (1.0E-6 Torr with chamber baking ) |
Water Chiller | One digital temperature controlled recirculating water chiller is included. Refrigeration range: 5~35 °C Flow rate: 16 L/min Pump pressure: 14 psi |
Overall Dimensions | Lid closed: 48″ × 28″ × 32″ Lid open: 48″ × 28″ × 37″ |
Net Weight | 160 kg |
Warranty | One years limited warranty with lifetime support |
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